curing accelerator

Expediting setting adhesives with low cost in room temperature was prepared by bisphend a epoxy resin,polyamide 650 and composite solidified accelerator.

以双酚 A环氧树脂为基料 ,低分子聚酰胺 6 5 0为固化剂 ,添加复合固化促进剂 ,制得低成本室温快速固化胶粘剂。