bonding force

Some statistical variables such as the average and standard deviation of bonding forces were defined.

利用有限元分析方法研究了在铜金属化晶片上进行金引线热超声键合过程中的键合力变化情况,建立了基于率相关材料特性的热超声键合有限元模型,对键合中的碰撞和超声两个过程进行了仿真分析,并引入平均键合力、键合力标准差值等统计参量来判定键合力的波动变化,从而更加准确地揭示了各键合参数对键合力波动的影响规律。

A strategy of wafer-level-plastic-packaging for MEMS based on adhesive bonding;

基于粘附剂键合的圆片级MEMS塑料封装技术

Electrostatic-alloy bonding technique used in MEMS;

MEMS中的静电-热键合技术

Application of laser fusing bonding of silicon/glass in a novel uncooled infrared detector;

激光熔融键合在新型室温红外探测器的应用

Studies on Photosensitive Dyes Binding to Monocrystalline Germanium Surface;

单晶锗表面键合光敏染料的研究

Binding of Ionic Derivative of Pyrene to Strong Polyelectrolyte;

强聚电解质对离子型芘衍生物探针的键合

Studies of photosensitive dyes binding to monocrystalline germanium surface;

单晶锗表面键合光敏染料及其电流-电压曲线的测定

The defect distribution of bonded wafers and its relationship to the Weibull modulus;

硅片键合界面缺陷分布与Weibull模数的关系

Study on a New Al-1%Si Bonding Wire for Encapsulation of Integrate Circuit;

集成电路封装用新型Al-1%Si键合线的研制

3 mm) was bonded directly on an aluminum nitride substrate by heating.

通过高温热氧化的方法 ,在AlN陶瓷表面形成一薄层Al2 O3作为过渡层 ,成功地将铜与AlN陶瓷键合在一起 ,研制出性能优越的AlN陶瓷覆铜基板 。