crystal growth from vapour

A high-heat-capacity printed circuit board(PCB)is soldered in the vapor phase soldering process by using the self-made low melting point Sn-Bi-X alloy as a solder.

采用自行研制的低熔点Sn-Bi-X合金作为焊料,对高热容量的印制板进行汽相焊接,圆满解决了高温型无铅回流焊接中难以克服的各种焊接故障。

This paper addresses the associated processing steps necessary to solder two-sided connector boards using selective soldering in stead of vapor phase soldering.

论述了利用选择性焊接来代替汽相焊系统焊接双面连接板时所需的相关工艺步骤,讨论了通过引入双重回焊技术,使复杂的混合技术板路焊接由波峰焊转化为选择性焊接时,如何改善工艺灵活性,减少成本并保持低缺陷率。

Analysis of cooperative removal of PM_(2.5) by heterogeneous condensation in wet flue gas desulphurization;

湿法脱硫中应用蒸汽相变原理协同脱除PM_(2.5)的技术分析

Analysis of cooperative removal of PM_(2.5) by heterogeneous condensation in semi-dry FGD process;

半干法脱硫中应用蒸汽相变机理协同脱除PM_(2.5)的技术分析