very large telescope

Investigation on the Final Polishing of Silicon Substrate in ULSI;

甚大规模集成电路制备中硅衬底精密抛光的研究

The copper chemical-mechanical polishing (CMP) which is the key planarization technology for ULSI manufacturing was discussed.

对用于甚大规模集成电路(ULSI)制造的关键平坦化工艺———铜化学机械抛光(CMP)技术进行了讨论。