cathode-ray spot

Advances in vacuum arc cathode spots

真空电弧阴极斑点的研究进展

By using a Scanning Electron Microscope (SEM), the tracks of cathode spots on the surface of nanocrystalline Cu cathode produced after the first discharge with peak current of 10 A was investigated.

采用扫描电子显微镜(SEM)观察了纳米Cu阴极在峰值电流为10A的小击穿电流下首击穿后的阴极表面烧蚀形貌,发现纳米Cu的阴极斑点从产生到熄灭期间的运动(即短程运动)并不是随机的,而是有一定取向的;进一步通过和常规Cu首击穿烧蚀形貌对比,分析了产生有向运动的原因。

The tracks of cathode spots produced after the first discharge on the surfaces of nanostructured and conventional W-Cu cathodes were investigated using a scanning electron microscope (SEM), and the influence of microstructure of composites on the morphology and movement of cathode spots was studied.

采用扫描电子显微镜观察了W-Cu复合电弧阴极材料首击穿后的表面形貌,研究了复合阴极材料微观结构对阴极烧蚀形貌和阴极斑点运动的影响。

The traces of cathode spots on the surface of coarse-crystalline and nano-crystalline CuCr25 alloys have been observed using a scanning electron microscope (SEM).

采用扫描电镜对纳米晶和粗晶CuCr25合金阴极斑点蚀坑形貌进行观察。

The tracks of cathode spots produced after on the surfaces of cathode activated with different size ThO2 were investigated using a scanning electron microscopy.

用扫描电镜对具有不同大小ThO2粒子的阴极材料击穿后表面上阴极斑点的形貌进行了观察。

The discrimination between CuCr25 and CuCr50 alloys for the cathode spot craters with peak currents of 10 A and 80 A has been studied in this paper.

研究了在峰值电流分别为10A和80A的小击穿电流下,CuCr25与CuCr50合金阴极斑点蚀坑形貌的差异。

In this paper,effects of point cathode anodic bonding are theoretically investigated by using electrical circuit analog.

为此 ,本文用等效电路的方法研究了点阴极情况下的电场辅助阳极连接效应 ,计算了连接电流、连接孕育期和紧密接触面积。