chip-level

The author offers a general method and steps to do a chip- level- porting to an unsupported processor.

6版本内核向具体处理器的芯片级移植的一般方法和步骤。

Chip scale package (CSP) for flip-chip on hard substrates and wafer re-distribution is studied, and its process flow is described.

对刚性基板倒装式和晶圆再分布式两种结构的芯片级封装(CSP)进行了研究,描述了CSP的工艺流程;详细讨论了CSP的几项主要关键技术结构设计技术,凸点制作技术,包封技术和测试技术;阐述了采用电镀和丝网漏印制备焊料凸点的方法。