一种微电子电路器件，其中的无源元件及内部金属连线直接在绝缘衬底上形成，然后再加上有源半导体器件（通常以大圆片形式给出）。 Microelectronic circuits in which the passive components and their metallic interconnections are formed directly on an insulating substrate and the active semiconductor devices(usually in wafer form) are added subsequently.