peritectic temperature

To eliminate the deposition along BaCuO_2 grain boundaries, the 211(Y_2Ba_2CuO_5) powder was properly doped to the 123 (YBa_2Cu_3O_(7-x) compounds.

用液相烧结法研究了制备名义组成(123+211)织构的YBa_2Cu_3O_(7-x)超导体在123(YBa_2Cu_3O_(7-x))粉中掺适量的211(Y_2BaCuO_5)粉消除BaCuO_2在晶界上沉积在包晶转变温度附近降低冷却速率允许有足够时间沿a—b面进行质量转移,a—b面是最快的生长面,晶粒长度受质量转移速率控制XRD,SEM,EDXA分析指出,晶粒是长条形,取向垂直于c轴,平行于表面样品123具有强织

The main factors affecting DAP caking are discussed: higher packing temperature(60℃actually while 50℃designed),too many tiny particles(1～2 mm),higher moisture(2.

分析影响磷酸二铵产品结块的主要因素:包装温度高(设计≤50℃;实际≥60℃);细小颗粒(1~2mm)较多;水分含量高(2。

Effect of Regenerative Baking on Lining Temperature Uniformity of an 160 t Ladle;

蓄热式烘烤对160t钢包衬温度均匀性的影响

To improve billet quality and the trackability and stability of secondary cooling water during continuous casting,the tundish temperature is introduced into the water distribution for secondary cooling to design the relevant control system,based on the distribution model,tundish temperature,surface temperature and fuzzy self-adaptive PID.

为改善铸坯质量,提高二冷水量的跟踪性和稳定性,将中包温度引入二冷配水,设计出基于配水模型、中包温度、铸坯表面温度及模糊自适应PID的连铸二冷控制系统,并在实验室搭建连铸二冷区喷淋仿真实验系统。

The effect of the granularity of copper powder、the concentration of [Ag(NH3)]+、the temperature of plate and the content of dispersant on the content of silver and resistance rate was researched.

采用[Ag(NH3)]+溶液对片状铜粉进行包覆试验,研究了铜粉粒度、[Ag(NH3)]+溶液浓度、包覆温度、分散剂含量等因素对银包铜粉银含量和电阻率等性能的影响,通过控制包覆温度(60℃)、银络离子浓度(0。